= Packing, includes as an area of micro-system technology all the technologies and design tools for the integration of mikroelectrical components on smallest needed space.
Packing enables connection with non microelectronic and microelectronic components to a complete system. Due to the increasing complexity of electronic microsystems is a component of the procedural designanalytic competence in the field CAD design / layout.

Result from the technology for electrical connection (soil) by microelectronic connections of bare semiconductors (microchip or Die) and the sealing, casting, encapsulation, housing.
The Packing developed from parts of the subjects of the e-technology, micro-welding technology and material science to an independent engineering discipline in the field of microsystems technology.