Our Spectrum:

• Customized Development Circuit Diagram, Layout, Simulation,
• Component – Purchasing
• Manufacturing of Electronic Boards and Systems
• Delivery of complet Systems

Subtrate:

• Ceramic (Inhouse Produktion, Printing of conductive layers, resistors, and, Lasertrimming)
• PCB
• PCB with Flex
• Flex
• Metall
• COB
• IMS

Manufacturing Technologies:

• SMD (Assembling up to Type 0201 or BGA > 1000 Balls Pitch < 0,8 mm)
• Soldering (also in Vacuum) and Conductive-Gluing
• COB Chip On Board; DIE and Wire Boding thinn + thick; FlipChip
• Sealing, Casting, Encapsulating, Coating, Transfer Mold
• Mounting, Completing, ready-made modules,
• Testing (AOL, Flying Probe, InCircuit, Environmental Tests, Themperatur, Humidity, Shock and so on) Qualification